TY  - JOUR
U1  - Zeitschriftenartikel, wissenschaftlich - begutachtet (reviewed)
A1  - Wang, Yue
A1  - Kang, Victor
A1  - Federle, Walter
A1  - Arzt, Eduard
A1  - Hensel, René
T1  - Switchable Underwater Adhesion by Deformable Cupped Microstructures
JF  - Advanced Materials Interfaces
N2  - Abstract Switchable underwater adhesion can be useful for numerous applications, but is extremely challenging due to the presence of water at the contact interface. Here, deformable cupped microstructures (diameter typically 100 µm, rim thickness 5 µm) are reported that can switch between high (≈1 MPa) and low (<0.2 MPa) adhesion strength by adjusting the retraction velocity from 100 to 0.1 µm s–1. The velocity at which the switch occurs is determined by specific design parameters of the cupped microstructure, such as the cup width and angle. The results are compared with theoretical estimates of water penetration into the contact zone and expansion of the cup during retraction. This work paves the way for controlling wet adhesion on demand and may inspire further applications in smart adhesives.
Y1  - 2020
UN  - https://nbn-resolving.org/urn:nbn:de:bsz:291:415-4864
SN  - 2196-7350
SS  - 2196-7350
U6  - https://doi.org/10.1002/admi.202001269
DO  - https://doi.org/10.1002/admi.202001269
VL  - 7
IS  - 23
SP  - 2001269
ER  -