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Effect of Subsurface Microstructures on Adhesion of Highly Confined Elastic Films

  • Polymer adhesive films sandwiched between two rigid solids are a common bonding strategy. The mechanics and consequently the adhesion of such geometrically confined films depend mainly on their thickness, Young's modulus, and the Poisson's ratio of the material. In this work, we explore the effect of a micropatterned subsurface embedded into the adhesive layer. We compare experiments with three-dimensional numerical simulations to evaluate the impact of the microstructure on the contact stiffness and effective modulus. The results are used to extend a previously proposed size scaling argument on adhesion from incompressible to slightly compressible films to account for the silicone used in our study with a Poisson's ratio of 0.495. In addition, interfacial stress distributions between the elastic film and the glass disc are obtained from plane strain simulations to evaluate characteristic adhesion failures such as edge cracks and cavitation. Overall, the micropatterned subsurface has a large impact on the contact stiffness, the interfacial stress distribution, and the detachment behavior; however, the adhesion performance is only slightly improved in comparison to a non-patterned subsurface.

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Document Type:Article
Author:Manar SamriORCiD, Attila KossaORCiD, René HenselORCiD
Parent Title (English):Journal of Applied Mechanics
First Page:031009
Year of first Publication:2021
Release Date:2022/08/16
Tag:adhesion; bioinspiration; computational mechanics; micromechanics
Impact:02.794 (2021)
Funding Information:Leibniz-Gemeinschaft (MUSIGAND K279/2019); UNKP-19-3 New National Excellence Program of the Ministry for Innovation and Technology, Hungary Hungarian National Research, Development and Innovation Office (NKFI FK 128662).
Research Departments:Funktionelle Mikrostrukturen
DDC classes:500 Naturwissenschaften und Mathematik / 540 Chemie
Open Access:Open Access
Signature:INM 2021/026
Licence (German):License LogoCreative Commons - CC BY - Namensnennung 4.0 International