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Switchable Underwater Adhesion by Deformable Cupped Microstructures

  • Abstract Switchable underwater adhesion can be useful for numerous applications, but is extremely challenging due to the presence of water at the contact interface. Here, deformable cupped microstructures (diameter typically 100 µm, rim thickness 5 µm) are reported that can switch between high (≈1 MPa) and low (<0.2 MPa) adhesion strength by adjusting the retraction velocity from 100 to 0.1 µm s–1. The velocity at which the switch occurs is determined by specific design parameters of the cupped microstructure, such as the cup width and angle. The results are compared with theoretical estimates of water penetration into the contact zone and expansion of the cup during retraction. This work paves the way for controlling wet adhesion on demand and may inspire further applications in smart adhesives.

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Document Type:Article
Author:Yue WangORCiD, Victor KangORCiD, Walter FederleORCiD, Eduard ArztORCiD, René HenselORCiD
Parent Title (English):Advanced Materials Interfaces
First Page:2001269
Year of first Publication:2020
Release Date:2022/11/18
Impact:06.147 (2020)
Funding Information:European Research Council under the European Union's Seventh Framework Programme (FP/2007-2013)/ERC grant agreement no. 340929 and through the European Union's Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement no. 642861.
Research Groups:Functional Microstructures
Open Access:Open Access
Signature:INM 2020/098
Licence (German):License LogoCreative Commons - CC BY-NC-ND - Namensnennung - Nicht kommerziell - Keine Bearbeitungen 4.0 International