Open Access

Silver nanowires (AgNW) find use in transparent conductive electrodes with applications in solar cells, touch screens, and wearables. Unprotected AgNW are prone to atmospheric corrosion and lose conductivity over time. Known passivation techniques either require submersion of pre-deposited AgNW in liquid compounds or the modification of AgNW inks prior to deposition, which alters viscosity and complicates deposition. Here, new possibilities for stabilization of pre-deposited AgNW networks without need for submersion are explored. It is demonstrated that AgNW networks can be stabilized either by argon or hydrogen plasma treatment or by solvent vapor annealing with ethanol, methanol, or ethyl acetate. These treatments yielded stable electrical resistance over at least nine weeks, whereas untreated or thermally annealed AgNW layers quickly lost conductivity. The potential of solvent vapor annealing is further explored by demonstrating a new processing technique for stable polymer matrix composites containing AgNW. Co-deposited layers of AgNW with polystyrene microbeads are annealed in ethyl acetate vapor to stabilize the AgNW while at the same time merging polymer beads into a closed film around the AgNW. The resulting composites maintained stable resistance and transmittance for at least seven weeks.

We directed the self-assembly of nanoscale colloids via direct nanoimprint lithography to create flexible transparent electrodes (FTEs) with metal line widths below 3 μm in a roll-to-roll-compatible process. Gold nanowires and nanospheres with oleylamine shells were imprinted with soft silicone stamps, arranged into grids, and converted into metal lines in a plasma process. We studied the hierarchical structure and opto-electronic performance of the resulting grids as a function of particle geometry and concentration. The performance in terms of optical transmittance was dominated by the line width. Analysis of cross-sections indicated that plasma sintering only partially removed the insulating ligands and formed lines with thin conductive shells and a non-conductive core. We provide evidence that the self-assembly of high-aspect nanowires can compensate for defects of the stamp and substrate irregularities during imprinting, while spheres cannot. The wire-based electrodes thus outperformed the sphere-based electrodes at ratios of optical transmittance to sheet resistance of up to ≈ 0.9 %·Ωsq-1, while spheres only reached ≈ 0.55 %·Ωsq-1.

We report the synthesis of AgNP@PEDOT:PSS hybrid conductive particles with silver cores and polythiophene shells that can be used to formulate sinter-free inks for printing electronics. First, Ag nanocrystals capped with the weakly bound ligand aminohexanoic acid (ε-Ahx) are prepared. The ligand shell is exchanged by reacting the dispersion with the polymer ionomer mixture poly(3,4-ethylene dioxythiophene):polystyrene sulfonate (PEDOT:PSS). The particles are characterized by electron microscopy, dynamic light scattering, Z potential, and Raman spectroscopy, confirming the replacement of the ligands on the metal particle surface. The resulting dispersion is colloidally stable as confirmed by DLS. Inks with a solid content of the hybrid particles of 300 mg mL−1 were prepared and deposited on different substrates. The new particles are components for hybrid inks that become electrically conductive without any chemical or thermal post-deposition treatment. We show that silver-based hybrid inks can be deposited on different substrates and possess an average conductivity after 24 h of drying at room temperature of 1.726 × 106 S m−1 ± 0.326 × 106 S m−1, only one order of magnitude lower than elemental silver and within the same order of magnitude as their gold ink counterpart.

Soft-adaptive electronics require both sensor and conductor materials. The key parameter for these materials is their mechanoelectrical properties. Liquid metals and solid conductive composites have been exploited in this application field, but both are limited by either their chemical stability or limited flexibility, respectively. Electrofluids are a novel approach towards soft electronic components. They are concentrated colloidal suspensions of conductive particles, in which dynamic contacts retain electrical conductivity under deformation, filling the gap between liquid metals and solid composites. Here, we study the mechanical and electrical network interplay of electrofluids based on multi-walled carbon nanotubes (MWCNTs) in glycerol. These networks arise at different filler concentrations, showing a different response to external deformations. We found that electrical conductivity occurs without the presence of a rigid mechanical network, which allows MWCNT suspensions to be electrically conductive even under flow conditions. By performing rheoelectrical measurements, we observed how the mechanical and electrical networks evolved with the applied deformation. We demonstrated the applicability of electrofluids with tailored mechanoelectrical properties as soft electrical connectors.

Hybrid dielectrics were prepared from dispersions of nanoparticles with gold cores (diameters from 2.9 nm to 8.2 nm) and covalently bound thiol-terminated polystyrene shells (5000 Da and 11 000 Da) in toluene. Their microstructure was investigated with small angle X-ray scattering and transmission electron microscopy. The particles arranged in nanodielectric layers with either face-centered cubic or random packing, depending on the ligand length and core diameter. Thin film capacitors were prepared by spin-coating inks on silicon substrates, contacted with sputtered aluminum electrodes, and characterized with impedance spectroscopy between 1 Hz and 1 MHz. The dielectric constants were dominated by polarization at the gold–polystyrene interfaces that we could precisely tune via the core diameter. There was no difference in the dielectric constant between random and supercrystalline particle packings, but the dielectric losses depended on the layer structure. A model that combines Maxwell–Wagner–Sillars theory and percolation theory described the relationship of the specific interfacial area and the dielectric constant quantitatively. The electric breakdown of the nanodielectric layers sensitively depended on particle packing. A highest breakdown field strength of 158.7 MV m−1 was found for the sample with 8.2 nm cores and short ligands that had a face-centered cubic structure. Breakdown apparently is initiated at the microscopic maxima of the electric field that depends on particle packing. The relevance of the results for industrially produced devices was demonstrated on inkjet printed thin film capacitors with an area of 0.79 mm2 on aluminum coated PET foils that retained their capacity of 1.24 ± 0.01 nF@10 kHz during 3000 bending cycles.