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Scientific Unit
The potential of a new design of adhesive microstructures in the micrometer range for enhanced dry adhesion is investigated. Using a two-photon lithography system, complex 3D master structures of funnel-shaped microstructures are fabricated for replication into poly(ethylene glycol) dimethacrylate polymer. The diameter, the flap thickness, and the opening angle of the structures are varied systematically. The adhesion of single structures is characterized using a triboindenter system equipped with a flat diamond punch. The pull-off stresses obtained reaches values up to 5.6 MPa, which is higher than any values reported in literature for artificial dry adhesives. Experimental and numerical results suggest a characteristic attachment mechanism that leads to intimate contact formation from the edges toward the center of the structures. van der Waals interactions most likely dominate the adhesion, while contributions by suction or capillarity play only a minor role. Funnel-shaped microstructures are a promising concept for strong and reversible adhesives, applicable in novel pick and place handling systems or wall-walking robots.
We synthesized CuZr/Cu multilayers and performed nanoindentation testing to explore the dependence of plastic deformation modes on the thickness of CuZr layers. The Cu layers were 18 nm thick and the CuZr layers varied in thickness from 4 nm to 100 nm. We observed continuous plastic co-deformation in the 4 nm and 10 nm CuZr − 18 nm Cu multilayers and plastic-induced shear instability in thick CuZr layers (>20 nm). The plastic co-deformation is ascribed to the nucleation and interaction of shear transformation zones in CuZr layers at the adjacent interfaces, while the shear instability is associated with the nucleation and propagation of shear bands in CuZr layers. Shear bands are initialized in the CuZr layers due to the accumulated glide dislocations along CuZr-Cu interfaces, and propagate into adjacent Cu layers via slips on {111} plane non-parallel to the interface. Due to crystallographic constraint of the Cu layers, shear bands are approximately parallel to {111} plane in the Cu layer.
In order to investigate the effect of grain boundaries on the mechanical response in the micrometer and submicrometer levels, complementary experiments and molecular dynamics simulations were conducted on a model bcc metal, tantalum. Microscale pillar experiments (diameters of 1 and 2 μm) with a grain size of ∼ 100-200 nm revealed a mechanical response characterized by a yield stress of ∼1,500 MPa. The hardening of the structure is reflected in the increase in the flow stress to 1,700 MPa at a strain of ∼0.35. Molecular dynamics simulations were conducted for nanocrystalline tantalum with grain sizes in the range of 20-50 nm and pillar diameters in the same range. The yield stress was approximately 6,000 MPa for all specimens and the maximum of the stress-strain curves occurred at a strain of 0.07. Beyond that strain, the material softened because of its inability to store dislocations. The experimental results did not show a significant size dependence of yield stress on pillar diameter (equal to 1 and 2 um), which is attributed to the high ratio between pillar diameter and grain size (∼10-20). This behavior is quite different from that in monocrystalline specimens where dislocation ‘starvation’ leads to a significant size dependence of strength. The ultrafine grains exhibit clear ‘pancaking’ upon being plastically deformed, with an increase in dislocation density. The plastic deformation is much more localized for the single crystals than for the nanocrystalline specimens, an observation made in both modeling and experiments. In the molecular dynamics simulations, the ratio of pillar diameter (20-50 nm) to grain size was in the range 0.2 to 2, and a much greater dependence of yield stress to pillar diameter was observed. A critical result from this work is the demonstration that the important parameter in establishing the overall deformation is the ratio between the grain size and pillar diameter; it governs the deformation mode as well as surface sources and sinks, which are only important when the grain size is of the same order as the pillar diameter.
Small-scale metal structures play a crucial role in a broad range of technological applications. However, knowledge of mechanical properties at this size scale is lacking. Size strengthening effects are generally experienced at the microscale. Compression of non-free defect body centered cubic (BCC) metal micropillars has revealed that the size effect of these metals scales with a temperature ratio that signifies how much the yield strength is governed by screw dislocation mobility. So far, no effort has been made to systematically study the effect of screw dislocation mobility and lattice resistance on the size effect in BCC-based metals. Thus, this work investigated this in BCC tungsten (W) and tantalum (Ta), as well as B2 beta-brass (β-CuZn) and nickel aluminide (NiAl). The influence of temperature on the size effect in W and Ta was studied up to 400 °C, whereas the room-temperature size effect in β-CuZn and NiAl was studied as a function crystal orientation and deformation rate. It was found that the size effect scaled with the magnitude of the lattice resistance, which is strongly related to the screw dislocation mobility. Direct evidence of the mobility of screw dislocations was observed for the first time. The results also showed that plastic anisotropy vanishes with decreasing sample size and that ductility is considerably improved, thus highlighting the importance of dislocation-nucleation controlled deformation and screw dislocation mobility at the sub-micron scale.
The strength of metals increases with decreasing sample size, a trend known as the size effect. In particular, focused ion beam-milled body-centered cubic (BCC) micropillars exhibit a size effect known to scale with the ratio of the test temperature to the critical temperature (Tc) of the BCC metal, a measure of how much the yield stress is governed by the lattice resistance. In this paper, this effect is systematically studied by performing high-temperature compression tests on focused ion beam-manufactured Ta and W single crystal pillars ranging in diameter from 500 nm to 5 μm at temperatures up to 400 °C, and discussed in the context of bulk strength and size dependent stresses. Both metals show larger size effects at higher temperatures, reaching values that are in the range of FCC metals at temperatures near Tc. However, it is demonstrated that size effects can be considerably affected by material parameters such as dislocation density and lattice friction, as well as by the yield criterion used. Furthermore, for W, a change from uniform wavy deformation to localized deformation is observed with increasing temperature and pillar size, further indicating that the temperature ratio strongly influences the relative motion of screw and edge dislocations.
