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Scientific Unit
With steps towards Industry 4.0, it becomes imperative to the development of next-generation industrial assembly lines, to be able to modulate adhesion dynamically for handling complex and diverse substrates. The inspiration for the design and functionality of such adhesive pads comes from gecko’s remarkable ability to traverse rough and smooth topographies with great ease and agility. The emphasis in this thesis was to equip artificial micropatterned adhesives with such functionalities of tunability and devise an on-demand release mechanism. The project evaluates the potential of electric fields in this direction. The first part of this work focusses on integrating electric fields with polymeric micropatterns and studying the synergistic effect of Van der Waals and electrostatic forces. An in-house electroadhesion set up was built to measure the pull-off forces with and without electric fields. As a function of the applied voltage, adhesion forces can be tuned. The second part of the work demonstrates a novel route that exploits the in-plane actuation of the dielectric elastomeric actuators integrated with microstructure to induce peeling in them. Voltage-dependent actuation has been harnessed to generate the requisite peel force to detach the micropatterns. Overall, the findings of this thesis combine disciplines of electroadhesion, electroactuation, and reversible dry adhesives to gain dynamic control over adhesion.
In underwater adhesion of a topographically patterned surface with a very soft material such as human skin, the elastic deformation can be large enough to achieve solid-on-solid contact not only on top of the hills but also in the valleys of the substrate topography. In this context, we have studied the dynamics of dewetting of a thin liquid film confined between a rigid, periodic micropillar array and a soft, elastic sphere. In our experiments, we observed two very distinct dewetting morphologies. For large ratios of array period to micropillar height and width, the dewetted areas tend to have a diamond-like shape and expand with a rate similar to a flat, unpatterned substrate. When the array period is reduced, the morphology of the dry spot becomes irregular and its expansion rate is significantly reduced. We developed a fully coupled numerical model of the dewetting process that reproduces the key features observed in experiments. Moreover, we performed contact mechanics simulations to characterize the deformation of the elastomer and the shape of the dewetted area in a unit cell of the micropillar array.
Micropatterned dry adhesives rely mainly on van der Waals interactions. In this paper, we explore the adhesion strength increase that can be achieved by superimposing an electrostatic field through interdigitated subsurface electrodes. Micropatterns were produced by replica molding in silicone. The adhesion forces were characterized systematically by means of experiments and numerical modeling. The force increased with the square of the applied voltage for electric fields up to 800 V. For larger fields, a less-than-quadratic scaling was observed, which is likely due to the small, field-dependent electrical conductivity of the materials involved. The additional adhesion force was found to be up to twice of the field-free adhesion. The results suggest an alternative method for the controlled handling of fragile or miniaturized objects.
